A diverse team led by three ECE Florida faculty members is set to receive funding from the Defense Advanced Research Projects Agency (DARPA) to design and fabricate dynamic pressure sensors capable of performing at temperatures upwards of 800 °C (1472 °F), over a factor of 6X higher than any integrated pressure sensor currently in use. The $6.6M project, funded as part of the DARPA High Operational Temperature Sensors (HOTS) program, seeks to enable all manners of electronics and sensors that would be integral to industrial, military, and space applications. The core team is comprised of Dr. Mark Sheplak (lead PI), Dr. Roozbeh Tabrizian, and Dr. Philip Feng. The team’s platform, Integrated Harsh-Environment Analog Transducers (iHEAT), harnesses decades of collective experience in areas as diverse as aerodynamic sensor design, thin-film piezoelectric transducer development, and high-temperature physics.
