For several decades implantable bioelectronic neural interfaces have provided significant health benefits for patients suffering from various neurological diseases, deficits, or injuries. As the channel counts have increased, often so to do the therapeutic benefits of neuromodulation-based therapy. However, the lack of development of implantable connector technology for high-channel-count implants is limiting their successful development and translation to clinical trials. Existing commercial implant connector technology is limited to low channel counts (8 ch/lead). The proposed research described aims to overcome this implant-connector limitation by developing a new high-channel-density implantable connector technology that is scalable to high-channel-counts.
